China High Quality HDI PCB Manufacturer
product Description
Product description
- Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc
Parameter
| Parameter | Capability |
| Material | FR-4 |
| Layer Counts | 1-64 layers |
| Board Thickness | 0.4mm-17.5mm |
| Board Outline Tolerance | ±0.15mm |
| Thickness Tolerance ( t≥0.8mm) | ± 8% |
| Minimum laser hole | 0.075mm (3mil) |
| Minimum Trace Width | 0.075mm (3mil) |
| Mini Solder Mask Bridge | 0.05mm |
| Minimum Drill Size | 0.15 mm (6 mil) |
| Maximum Board Size | 1150mm × 560mm |
| Surface Finish | HASL,Immersion Gold,Immersion Tin,OSP,ENIG+OSP,Immersion Silver,ENEPIG,Gold Finger |
| Testing Methods | In-Circuit Test (ICT), Flying probe test, Visual Inspection |
| Quality Standards | IPC-A-600F and MIL-STD-105D CHINA GB<4588> |
| Acceptable File Format | ALL Gerber Files、POWERPCB、PROTEL、PADS2000、CAD、AUTOCAD、ORCAD、P-CAD、CAM-350、CAM2000 etc. |
HDI PCB Manufacturing Process
The overall process for manufacturing HDI PCB is essentially the same as for fabricating other PCB board, with notable differences for PCB stack-up and hole drilling. Since HDI boards generally require smaller drill holes for vias, laser drilling is usually required. Although laser drills can produce smaller and more precise holes, they are limited by depth. Therefore, a limited number of layers can be drilled through at a time. For HDI boards, which are invariably multilayer and may contain buried and blind vias, multiple drilling processes may be required. This necessitates successive layer boding to achieve the desired stack-up or sequential lamination cycles. Not surprisingly, this can significantly increase PCB manufacturing time and cost.
Customer Satisfaction
Unlike mechanical drills, the laser drilling process doesn’t physically contact the PCB material that it is working with. Drilling the smallest of microvias allows for more technology on the PCB surface. The high influence beam of the UV laser machine can drill through copper and organic dielectric (PP, epoxy resin, adhesive, PI, EMI shielding film and etc.) to create the tiny via hole. The UV laser has excellent reflection, absorption and transmission capacity on different materials. HDI PCBs always have a large laser drilling quantity per square meter, even more than 50K density since its high-density interconnection, and the laser machine drilling capacity always reaches 4.3million pieces daily.
HDI Board Stack-up
- 1+N+1 with laser microvia and mechanical buried core via. The “1” represents “build-up” or sequential lamination on each side of the core.i+N+i (i>=2) – PCBs contain 2 or more “build-up” of high-density interconnect layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in challenging designs.
Laser Direct Imaging (LDI) Technology
Imaging fine or ultra-fine traces than ever before to process these HDI boards is costly but necessary. Finer traces, spacing and annular ring requires much tighter controls. With use of finer traces, touch up rework or repair becomes an impossible task. Photo tool quality, laminate prepreg and imaging parameters are necessary for successful process. LDI (laser direct imaging) is a far better option for such fine traces and spacings. Laser direct imaging (LDI) capabilities ensure exacting registration and all multilayer inner cores receive a thorough check using Automated Optical Inspection (AOI) units for excellent defect detection of the finest features.
Laser Drilling Technology
Unlike mechanical drills, the laser drilling process doesn’t physically contact the PCB material that it is working with. Drilling the smallest of microvias allows for more technology on the PCB surface. The high influence beam of the UV laser machine can drill through copper and organic dielectric (PP, epoxy resin, adhesive, PI, EMI shielding film and etc.) to create the tiny via hole. The UV laser has excellent reflection, absorption and transmission capacity on different materials. HDI PCBs always have a large laser drilling quantity per square meter, even more than 50K density since its high-density interconnection, and the laser machine drilling capacity always reaches 4.3million pieces daily.
HDI PCB Materials Selection
Material type and construction is extremely important in designing and manufacturing HDI PCB boards. Designing HDI interconnects involves an understanding of the potential problems arising when specifying glass reinforced dielectric materials.
Microvia dielectric materials can introduce misregistration and rough vias whether plasma, laser, or mechanical drilling is performed. Not only are the material properties of the microvia dielectric materials called into question, but also the consistency of the weave, as well as the quality of the fibers used. The potential to close the weave openings by spreading the fibers out is extremely important, as this minimizes open spaces that cause skew and drift.
Copper Clad Laminate (CCL): Copper clad laminate materials have copper foil laminated onto one or both sides of cured (C-stage) dielectric. The rigid CCLs can be FR4, FR-5 or some PTFE. The typical application uses single-side clad laminate material where the copper clad is used as the outer layer and the c-stage is bonded to the sub-composite. Microvias are formed utilizing laser drilling methods. Materials available differ by reinforcement (woven glass, non-woven glass and expanded PTFE) and chemistries involved (epoxies, polyimide, polyester etc.).
Resin Coated Copper (RCC): Resin coated copper materials are compromised of copper foil, coated with a resin dielectric material that can be directly bonded to the sub-composite. They differ by whether they are wet processable or not. In non-wet processable-coated copper materials, microvias are formed utilizing plasma or laser drilling methods.
PP: Prepreg, also referred to B-stage, Bonding sheet, or simply Preg, which is composited of fiberglass fabric impregnated with resin. The resin has been partially cured but not hardened during the Prepreg coating operation. When heating the PCB stack-up in pressing process, the resin in PP will flow, stick and bond the PCB core with copper foil or other materials.
HDI Printed Circuit Board (PCB)
- What’s HDI PCB? High-density interconnect (HDI) PCBs are characterized by finer lines, closer spaces, and more dense wiring, which allow for a faster connection while reducing the size and bulk of a project. These boards also feature blind and buried vias, laser ablated microvias, sequential lamination, and via in-pads.
Why Choose Us
Extensive Industry Experience: With years of experience in the PCB manufacturing industry, we possess the expertise and knowledge to deliver exceptional results for our clients.
Reliable Partnership: We prioritize building enduring relationships with our customers based on trust, reliability, and mutual success.
Cost-Effective Solutions: Our competitive pricing ensures that you receive the best value for your investment without compromising on quality or performance.
Delivery Time
| 1-2L Lead-time | 3-7 days |
| 4- 8L Lead-time | 7-10 days |
| 10-18L Lead-time | 10-15 days |
| 20-28L Lead-time | 15-20 days |
| 28-64L Lead-time | 30 days |
If you need to customize PCBA, please contact us We will reply
within 2 hours, and complete the quotation within 4 hours or less
upon request.